AI Healthcare Industry in Life Science Industry: A Perspective View
AI; communication; healthcare; innovation system; life science; policymakers; resources; socio-technical; technology; TIS approach
The main goal of this study is to look at how well the innovation system for AI healthcare technology is working in the life science business and find things that are getting in the way of progress. A lot of different types of research were used for this study. It combines both quantitative and qualitative data from tertiary studies, business-related written sources, and conversations with 21 experts and 25 life science management leaders to get new ideas. The results make it clear that innovation system performance is being held back by a lack of resources and poor communication from top healthcare experts about what they need to improve healthcare with AI technology innovations. The study says that to deal with these problems, policymakers need to make changes that increase the resources that are available and come up with clear goals and visions for how AI technology can improve healthcare. Using the socio-technical technological advancement System (TIS) approach in the healthcare setting, the study adds to our knowledge of how the innovation system works and how different parts of it affect each other. Overall, this study throws light on the complicated ways that innovation works in the life science field. It gives lawmakers, industry workers, and other interested parties useful information for pushing AI healthcare technology forward in a sociotechnical framework. 2024 IEEE.
Sakthivel S.; Reddy M.U.; Arunkumar B.; Srisainath R.; Ashok J.; Desai P.M.
2024 4th International Conference on Advance Computing and Innovative Technologies in Engineering, ICACITE 2024, pp. 5-11.
Institute of Electrical and Electronics Engineers Inc.
Sakthivel S., Nehru Institute of Engineering and Technology, Department of Electrical and Electronic Engineering, Tamil Nadu, T.M.Palayam, India; Reddy M.U., Ies College of Technology, Department of Computer Science & Engineering, M.P, Bhopal, 462044, India; Arunkumar B., Karpagam Academy of Higher Education, Coimbatore, 641021, India; Srisainath R., Prince Shri Venkateshwara Padmavathy Engineering College, Department of Mechanical Engineering, Chennai, India; Ashok J., Christ University, Bangalore, India; Desai P.M., Cmr Technical Campus, Hyderabad, Medchal, 501401, India