Enhanced Design and Performance Analysis of a Seven-Level Multilevel Inverter for High-Power Applications
subject: Efficiency; IGBT; Inverter; PWM; THD
description: The structure and performance analysis of a seven-level multilevel inverter is discussed in this study. Due to their capacity to get around the drawbacks of traditional two-level inverters, like high voltage stress on power devices and harmonic distortion, multilevel inverters have attracted a lot of attention lately. Multiple voltage levels can be produced by the seven-level multilevel inverter which is being proposed because it uses a sequential arrangement of power sources and capacitors. The design methodology involves selecting appropriate power devices and capacitance values to achieve the desired voltage levels while minimizing losses and ensuring reliable operation. Total harmonic distortion (THD), inverter efficiency, and voltage stress on power devices are all considered as part of the performance analysis. In comparison to conventional two-level inverters, simulation results indicate that the proposed seven-level multilevel inverter offers lower THD, increased efficiency, and reduced voltage stress. This research contributes to the advancement of multilevel inverter technology and its potential applications in various power conversion systems. 2023 IEEE.
creator: Parimalasundar E.; Jayakumar S.; Nagajothi P.; Chandrika V.S.; Devaraju T.; Suresh K.
source: Proceedings of the 2023 2nd International Conference on Augmented Intelligence and Sustainable Systems, ICAISS 2023, pp. 1862-1868.
publisher: Institute of Electrical and Electronics Engineers Inc.
date: 2023-01-01
rights: Restricted Access
relation: ISBN: 979-835032579-9
format: Online
language: English
type: Conference paper
coverage: Parimalasundar E., Mohan Babu University (Erst while Sree Vidyanikethan Engineering College), Electrical and Electronics Engineering, Tirupati, India; Jayakumar S., Sri Sairam College of Engineering, Electronics and Communication Engineering, Bengaluru, India; Nagajothi P., S.A. Engineering College, Electrical and Electronics Engineering, Chennai, India; Chandrika V.S., Kpr Institute of Engineering and Technology, Electrical and Electronics Engineering, Coimbatore, India; Devaraju T., Mohan Babu University (Erst while Sree Vidyanikethan Engineering College), Electrical and Electronics Engineering, Tirupati, India; Suresh K., Christ University, Electrical and Electronics Engineering, Bangalore, India